586  0 Kommentare Leading Mobile Chipmaker Rockchip Selects FormFactor's Apollo(TM) MF100 MEMS Probe Card for Wafer Testing of 28nm Application Processors

LIVERMORE, CA--(Marketwired - Dec 8, 2014) - FormFactor, Inc. (NASDAQ: FORM) today announced that Rockchip, based in Fuzhou, China, has chosen FormFactor's Apollo™ MF100 MEMS probe card for wafer testing of its 28nm generation of application processors. Rockchip is China's leading fabless semiconductor company for mobile internet terminal devices, digital multimedia solutions and wireless communications, as well as application processors used in tablets, mobile phones, and IOT ecosystem products. The MEMS-based Apollo MF100 probe card addresses the precise, low-force, high-performance requirements needed for production testing of today's advanced integrated circuits, which feature increasing levels of on-chip integration and I/O density. This selection extends FormFactor's presence and technology leadership in the fast-growing Chinese fabless semiconductor market.

"FormFactor has an established reputation of working very closely with customers during a new product's design phase. Such early collaboration ensures wafer test feasibility, and assures highest probe card performance when a product goes into volume production," said Mr. Huang Xu, Rockchip's Vice President. "The close collaboration coupled with FormFactor's industry-proven advanced copper pillar probing technology and expertise made adoption of the MF100 MEMs probe card for our new 28nm product a natural choice."

Increasing on-chip integration, together with shrinking chip sizes, are continuing to drive reductions in packaging pitches to enable complete access to the entire device functionality. Copper pillars, which are typically fabricated using photolithography and plating techniques, enable devices to be packaged at pitches at and below 100μm, far denser than the capability of mainstream solder-bump packaging processes. Copper pillars also offer significant performance advantages over solder bumps, including higher electrical and thermal conductivity, as well as improved electromigration reliability. As a result of these benefits, copper pillar packaging is rapidly becoming the interconnect technology of choice for advanced integrated circuits, especially for highly-integrated, high-performance mobile applications like smartphones and tablets.